﻿{"id":2747,"date":"2025-01-28T16:11:07","date_gmt":"2025-01-28T07:11:07","guid":{"rendered":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/?page_id=2747"},"modified":"2025-06-09T10:54:13","modified_gmt":"2025-06-09T01:54:13","slug":"iceme2025","status":"publish","type":"page","link":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/iceme2025\/","title":{"rendered":"ICEME2025"},"content":{"rendered":"\n<h1 style=\"text-align: center; line-height: 1.5;\"><span style=\"color: #0000ff;\">International Conference on Electrical<\/span><\/h1>\n<h1 style=\"text-align: center; line-height: 1.5;\"><span style=\"color: #0000ff;\">and Electronic Materials Engineering<\/span><\/h1>\n<p style=\"text-align: center;\"><span style=\"color: #000000;\"><strong>June 28, 2025<\/strong><\/span><\/p>\n<p style=\"text-align: center;\"><span style=\"color: #000000;\"><strong>Osaka Institute of Technology<\/strong><\/span><br><span style=\"color: #000000;\"><strong> Umeda Campus<\/strong><\/span><br><span style=\"color: #000000;\"><strong> Osaka, JAPAN<\/strong><\/span><\/p>\n<p style=\"text-align: center;\"><span style=\"color: #000000;\"><strong>Organizer: ICEME Organizing Committee<\/strong><\/span><br>\n\n<h2><span style=\"color: #0000ff;\"><strong>Invitation<\/strong><\/span><\/h2>\n<p>The ICEME Organizing Committee cordially invites you to participate in the International Conference on Electrical and Electronic Materials Engineering (ICEME 2025), which will be held in Osaka on June 28, 2025. A warm invitation is also extended to accompanying guests,\nor whom a social program will be organized.<\/p>\n\n<h2><span style=\"color: #0000ff;\">Scope and Topics<\/span><\/h2>\n<p>The Conference is an interdisciplinary forum for the exchange and discussion of ideas, research, and practical experiences on electrical and electronic material engineering. It addresses itself to electrical engineers, electronic engineers, material scientists, physicists, chemists, and scientists and engineers who are engaged in research and practical application in these fields.<\/p>\n<p>The main topics of the Conference are:<\/p>\n<ul>\n<li>Basic Properties<br>\nCharge carriers, Electrical conduction, Electronic states in materials, Photoconductivity, Dielectric properties, Optical properties, Electro-optic effects, Nonlinear optical effects, Magnetic properties, High field effects, etc.<\/li>\n<li>Materials<br>\nGases, Liquids, Liquid Crystals, Solids, Insulators, Semiconductors, Metals, Super-conductors, Chemical synthesis, Crystal growth, Self-assembly, Thin film formation, Multilayers, etc.<\/li>\n<li>Electronic Devices<br>\nElectronic elements (resister, capacitor, etc.), Junction devices such as diodes, transistors, FETs, Sensors, Photovoltaic devices, Superconductor devices, etc.<\/li>\n<li>Optoelectronic Devices<br>\nOptical switches, Modulator, Optical fibers, Liquid crystal devices, Display, Lasers, Nonlinear optical devices, etc.<\/li>\n<li>Electrical Devices<br>\nCable, Transformer, Generator, etc.<\/li>\n<li>High Voltage Phenomena and Insulation<br>\nPre-breakdown phenomena, Breakdown phenomena, Degradation process, Insulation system, etc.<\/li>\n<li>Advanced Experimental Methods and Devices<br>\nMeasuring technique, Detectors, etc.<\/li>\n<li>Others<\/li>\n<\/ul>\n<h2><span style=\"color: #0000ff;\">Invited Speakers<\/span><\/h2>\n<p>Plenary lectures by invited speakers are planned for the ICEME 2025.<\/p>\n<\/ul>\n<h2><span style=\"color: #0000ff;\">Registration Information<\/span><\/h2>\n<body>\n    <div class=\"box\">\n      <table>\n        <tr>\n          <th><strong>Participation category<\/strong><\/th>\n          <th><strong>Fees<\/strong><\/th>\n        <\/tr>\n        <tr>\n          <td>Participation with Contributed Talk<\/td>\n          <td>JPY 3,000<\/td>\n        <\/tr>\n        <tr>\n          <td>Participation as an Audience<\/td>\n          <td>JPY 2,000<\/td>\n        <\/tr>\n      <\/table>\n      <p class=\"note\">Only the on-site payment by cash is acceptable.<\/p>\n    <\/div>\n<\/body>\n\n<h2><span style=\"color: #0000ff;\">Program<\/span><\/h2>\n<p>To access the programme, click on the link below.<\/p>\n<a href=\"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-content\/uploads\/2025\/06\/ICEME2025_Program_v4.pdf\">ICEME2025_Program<\/a>\n\n<h2><span style=\"color: #0000ff;\">Organizing Committee<\/span><\/h2>\n<table class=\"iceme-table\">\n<tbody>\n<tr>\n<th>M. Ozaki (Chairman)<\/th>\n<th>Osaka University<\/th>\n<\/tr>\n<tr>\n<td>R. Ito<\/td>\n<td>Akita Prefectural University<\/td>\n<\/tr>\n<tr>\n<td>H. Kajii<\/td>\n<td>Osaka University<\/td>\n<\/tr>\n<tr>\n<td>T. Kawai<\/td>\n<td>Nara Institute of Science and Technology<\/td>\n<\/tr>\n<tr>\n<td>T. Komoda<\/td>\n<td>Yamagata University<\/td>\n<\/tr>\n<tr>\n<td>J. Kyokane<\/td>\n<td>Toyohashi University of Technology<\/td>\n<\/tr>\n<tr>\n<td>T. Matsui<\/td>\n<td>Mie University<\/td>\n<\/tr>\n<tr>\n<td>S. Morita<\/td>\n<td>Nitto Denko Corporation<\/td>\n<\/tr>\n<tr>\n<td>H. Moritake<\/td>\n<td>National Defense Academy<\/td>\n<\/tr>\n<tr>\n<td>K. Nakayama<\/td>\n<td>Kindai University<\/td>\n<\/tr>\n<tr>\n<td>T. Ohsawa<\/td>\n<td>Kanagawa Institute of Industrial Science and Technology<\/td>\n<\/tr>\n<tr>\n<td>R. Ozaki<\/td>\n<td>Ehime University<\/td>\n<\/tr>\n<tr>\n<td>G. Shibuya<\/td>\n<td>Elcyo Co., Ltd.<\/td>\n<\/tr>\n<tr>\n<td>Y. Shimizu<\/td>\n<td>Nara Institute of Science and Technology<\/td>\n<\/tr>\n<tr>\n<td>K. Tada<\/td>\n<td>University of Hyogo<\/td>\n<\/tr>\n<tr>\n<td>H. Ueno<\/td>\n<td>University of Hyogo<\/td>\n<\/tr>\n<tr>\n<td>S. Ura<\/td>\n<td>Kyoto Institute of Technology<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<h2><span style=\"color: #0000ff;\">International Advisory Committee<\/span><\/h2>\n<table class=\"iceme-table\">\n<tbody>\n<tr>\n<th>K. Yoshino (Honorary Chairman)<\/th>\n<th>Japan<\/th>\n<\/tr>\n<tr>\n<td>H. H. Chen<\/td>\n<td>ROC<\/td>\n<\/tr>\n<tr>\n<td>Q. D. Dao<\/td>\n<td>Vietnam<\/td>\n<\/tr>\n<tr>\n<td>W. Feng<\/td>\n<td>China<\/td>\n<\/tr>\n<tr>\n<td>R. Hidayat<\/td>\n<td>Indonesia<\/td>\n<\/tr>\n<tr>\n<td>J. C. Hwang<\/td>\n<td>ROC<\/td>\n<\/tr>\n<tr>\n<td>K. Kaneto<\/td>\n<td>Japan<\/td>\n<\/tr>\n<tr>\n<td>S. H. Kim<\/td>\n<td>Korea<\/td>\n<\/tr>\n<tr>\n<td>M. Lehmann<\/td>\n<td>Germany<\/td>\n<\/tr>\n<tr>\n<td>Y. Ohmori<\/td>\n<td>Japan<\/td>\n<\/tr>\n<tr>\n<td>D. H. Park<\/td>\n<td>Korea<\/td>\n<\/tr>\n<tr>\n<td>Z. V. Vardeny<\/td>\n<td>U.S.A.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<h2><span style=\"color: #0000ff;\">Executive Committee<\/span><\/h2>\n<table class=\"iceme-table\">\n<tbody>\n<tr>\n<th>A. Fujii<\/th>\n<th>Osaka Institute of Technology<\/th>\n<\/tr>\n<tr>\n<td>T. Hori<\/td>\n<td>Daikin Industries, Ltd.<\/td>\n<\/tr>\n<tr>\n<td>Y. Inoue<\/td>\n<td>National Defence Academy<\/td>\n<\/tr>\n<tr>\n<td>H. Kamifuji<\/td>\n<td>Osaka University<\/td>\n<\/tr>\n<tr>\n<td>K. Nakajima<\/td>\n<td>Osaka University<\/td>\n<\/tr>\n<tr>\n<td>K. Tagashira<\/td>\n<td>Panasonic Corporation<\/td>\n<\/tr>\n<tr>\n<td>Y. Tsukamoto<\/td>\n<td>Ehime University<\/td>\n<\/tr>\n<tr>\n<td>S. Uto<\/td>\n<td>Osaka Institute of Technology<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n<h2><span style=\"color: #0000ff;\">Executive Committee Chair<\/span><\/h2>\n<p><span style=\"color: #000000;\">Prof. Akihiko Fujii<\/span><br>\n<span style=\"color: #000000;\"> Department of Electrical and Electronic Systems Engineering<\/span><br>\n<span style=\"color: #000000;\"> Osaka Institute of Technology<\/span><br>\n<span style=\"color: #000000;\"> 2-1 Yamada-Oka, Suita,<\/span><br><span style=\"color: #000000;\"> 5-16-1 Omiya, Asahi-ku, Osaka 535-8585, Japan<\/span><br>\n<span style=\"color: #000000;\"> E-mail: a&#x6b;i&#104;&#x69;k&#111;&#x2e;f&#x75;&#x6a;i&#x69;&#64;&#111;&#x69;t&#46;&#x61;c&#x2e;&#x6a;p<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"International Conference on Electrical and Electronic Materials Engineering June 28, 2025 Osaka Institute of T &#8230;","protected":false},"author":10,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"_links":{"self":[{"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/pages\/2747"}],"collection":[{"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/users\/10"}],"replies":[{"embeddable":true,"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/comments?post=2747"}],"version-history":[{"count":20,"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/pages\/2747\/revisions"}],"predecessor-version":[{"id":2799,"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/pages\/2747\/revisions\/2799"}],"wp:attachment":[{"href":"http:\/\/opal.eei.eng.osaka-u.ac.jp\/httpdocs\/wp-json\/wp\/v2\/media?parent=2747"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}